We have extensive experience applying a range of move methods and packing techniques across semiconductor, medical, automotive, aerospace & electronic industries
OEM | REUSE CAPITAL EQUIPMENT | SHIPPING | STORAGE | HARVEST | HAZMAT | DISPOSAL
Protecting your asset is our priority
Semiconductor cleanroom relocation requires strategic planning, cleanroom compliant protocols and air flotation. Logos’ experienced operatives have used this method to relocate full wafer fabs globally. The Logos team develop a comprehensive plan before every move that outlines the entire moving process and collaborate with tool owners, facility managers, project managers and other contractors to ensure the plan is executed to specifications and within agreed timescales and budget.
With 20 years’ experience relocating factories globally, we can identify potential risks associated with the moving process and develop efficient strategies to mitigate them.
Our experienced team of operatives are professionally trained on international standards and bring a wealth of knowledge on regulations and guidelines related to packaging and transportation. We can guarantee the crate we manufacture and pack meets the necessary safety standards and legal requirements associated with the shipping method and will work alongside the customer to ensure the equipment is packed to the correct specifications
We use INTERCEPT Technology™
A greener and cleaner way of packaging product and protecting it against corrosion for up to 20 years.
Key features:
Recyclable
Reusable
PMUC approved
Wide temperature range
Protects ferrous and non-ferrous metals as well as alloys and plastics
Works with a combination of metal types
Permanent ESD protection with some products
Oil free: eliminates the need for and the removal of conservation coatings